lab double sided wafer polishing and lapping up to 2 in both side at the same time

lab double sided wafer polishing and lapping up to 2 in both side at the same time

  • double-sided polishing | sydor optics

    Double-Sided Polishing | Sydor Optics

    Double-sided grinding and polishing, also known as double-sided lapping and polishing is performed with particles suspended in a liquid vehicle to abrade parts equally from both surfaces. The process produces a relatively stress-free environment that induces minimal thermal distortion making it compatible with most optical materials.

  • bench-top double side lapping / polishing machine for max. 2

    Bench-top Double Side Lapping / Polishing Machine For Max. 2

    EQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can . lap and polish 4 pieces of wafers up to 2" in both side at the same time, and achieves TTV less than one . micron in 2" diameter area. It is an idea tool to prepare Si, Ge and oxide single crystal wafer with 2" diameter . or less in the laboratory.

  • double-sided lapping and polishing of wafers of brittle

    Double-sided lapping and polishing of wafers of brittle

    Lapping / Polishing (Wafers of brittle material) We are able to stably supply ultra-thin, high precision double sided lapping and polishing brittle wafers, focusing on crystal. In lapping process, the both sides of a wafer are polished simultaneously between upper and lower surface plates. It realizes high removal efficiency and processing accuracy.

  • what is single & double side fine grinding? | lapmaster wolters

    What is Single & Double Side Fine Grinding? | Lapmaster Wolters

    Lapping flat parts – single or double-side) is the abrasive machining process for removing material using a loose abrasive in a liquid mixture (known as a slurry) at low speeds. Loose abrasive is moving over the surface under pressure (fig. 1), will knead, abrade, chip or scrape away the surface of the workpiece (fig. 2).

  • hb-pm-160d bench-top double side lapping / polishing machine

    Hb-pm-160d Bench-top Double Side Lapping / Polishing Machine

    Hb-pm-160d Bench-top Double Side Lapping / Polishing Machine For Max. 2" Wafer , Hb-pm-160d Bench-top Double Side Lapping / Polishing Machine For Max. 2" Wafer,Metal Polishing Machine,Polishing Machines,Lapping Machines from Metal Polishing Machine Supplier or Manufacturer-Anhui Haibei Import & Export Co., Ltd.

  • double-sided lapping for parallelism and flatness

    Double-sided lapping for parallelism and flatness

    Valley provides both double side and single side lapping of metals including Stainless Steel, Aluminum, Copper, Titanium, alloys and others. The process is stress free without thermal distortion and is suitable for ferrous and non-ferrous materials. Typical double-sided lapping applications include: Precision piston rings; Precision spacers; Gage slacks; Seals; Computer components

  • optical materials: double-sided lapping and polishing

    Optical Materials: Double-Sided Lapping and Polishing

    With double-sided lapping and polishing (DSLP), the optical components are held in geared or sprocketed carriers that are driven in a planetary motion covering the full surface of the lapping plates and are subject to continually changing direction of rotation. They are processed between an upper and lower plate that, depending on machine design, can rotate either in the same direction or opposite directions, or remain stationary.

  • double side polished wafers - silicon valley microelectronics

    Double Side Polished Wafers - Silicon Valley Microelectronics

    Double Side Polished Wafers Silicon Valley Microelectronics’ product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. Double side polished wafers are typically required in semiconductor, MEMS, and other applications where wafers with tightly controlled flatness characteristics are required.

  • jengyueh enterprise co., ltd. - single / double side lapping

    JengYueh Enterprise Co., Ltd. - single / double side lapping

    Serving as professional manufacturer of lapping and polishing machine, with a laboratory dedicate to Nano Lapping Equipment Manufacturing & Lapping Process Development. Our company's services and products can be applied to all mirror lapping/polishing process, for all flat work piece from all industry.Providing customers the perfect lapping ...

  • double side polisher/lapper | products | speedfam

    Double Side Polisher/Lapper | Products | SpeedFam

    Double Side Polisher/Lapper SpeedFam double side machines support lap and polish of large-sized workpieces with carrier sizes from 30 inches to a small workpieces with carrier sizes of 2 inches. SpeedFam provides precision and productivity for a processing agenda compatible to all workpiece variations.

  • (pdf) optimization method for double-sided polishing process

    (PDF) Optimization Method for Double-sided Polishing Process

    The double-sided polishing process is widely adopted as the finishing stage of the wafer manufacturing, because wafers with good surface quality and flatness can be obtained economically.

  • double sided lapping troubleshooting

    Double Sided Lapping Troubleshooting

    Though flipping parts can be part of processing using a double sided flat lapping machine, (usually as a quasi "correction" attempt) by the very nature of double sided machines, BOTH sides of the work piece finishes at the same time. There is no Finish one side, then flip, then flip again. as might apply to single sided blocked work.

  • effect of double sided process parameters in lapping silicon

    Effect of Double Sided Process Parameters in Lapping Silicon

    The main focus is the silicon wafer with high accuracy of flatness; to reduce total thickness variation, waviness and roughness. In this paper the lapping experiment and analysis showed that the double sided lapping machine is able to produce total thickness variation less than 10 um at controlled process parameters within short processing time.

  • double side grinding and polishing

    Double side Grinding and Polishing

    Double-Side Polishing. Size: < 330mm diameter Flatness: < 1/30 wave at 632nm Parallelism: < 0.5 arc sec Surface Cosmetics: < 5-2 SD Surface Roughness: < 5 å Minimum Thickness: 0.2mm Maximum Diagonal: 480mm.

  • silicon wafer lapping - wafer services - pure wafer

    Silicon Wafer Lapping - Wafer Services - Pure Wafer

    Lapping reduces stress which can build up during the ingot slicing process, while also helping to remove defects on the wafer front and back sides. Pure Wafer maintains both single and double side lapping tools allowing for tailor made services depending on customer needs.

  • carrier for double side polishing machine and double side

    Carrier for double side polishing machine and double side

    A carrier for a double side polishing machine arranged between upper and lower lapping plates to which a polishing cloth is bonded and having a hole for holding a wafer held between the upper and lower lapping plates at the time of polishing, wherein the material of the carrier is titanium.

  • doubleside polishing - a technology mandatory for 300 mm

    Doubleside polishing - A technology mandatory for 300 mm

    To solve the problem, a new process chain composed by double-sided lapping and chemical mechanical polishing (CMP) is proposed to acquire both high flatness and surface integrity on thin copper ...

  • lapping and polishing machines » double side machines

    Lapping and Polishing Machines » Double Side Machines

    The key to the quality, speed and versatility of SPEEDFAM Double-sided Machine involves a principle known as the 4-way Motion. Utility of the 4-way Motion reduces machining time, surpassing the 2-way and 3-way Double sided machines.

  • simultaneous double side grinding of silicon wafers: a

    Simultaneous double side grinding of silicon wafers: a

    Simultaneous double side grinding of silicon wafers: a literature review Z.C. Li a , Z.J. Pei a, , Graham R. Fisher b a Department of Industrial and Manufacturing Systems Engineering, Kansas State University, Manhattan, KS 66506, USA

  • precision lapping and polishing systems

    PRECISION LAPPING AND POLISHING SYSTEMS

    diamond pastes, slurries and composite lapping/polishing materials in our purpose built facilities strictly manufactured to ISO 9001:2015 quality standards. Kemet Precision Lapping and Polishing Systems offer the most efficient and reliable method of producing precise surface geometry and finish whether flat, contoured or spherical.

  • optical materials: double-sided lapping and polishing

    Optical Materials: Double-Sided Lapping and Polishing

    In theory, the process requires a minimum of three parts. The actual number is determined by part quantity, part size, and machine size. With double-sided lapping and polishing (DSLP), the optical components are held in geared or sprocketed carriers that are driven in a planetary motion covering the full surface of the lapping plates and are subject to continually changing direction of rotation.

  • lapping and polishing machines » double side machines

    Lapping and Polishing Machines » Double Side Machines

    The key to the quality, speed and versatility of SPEEDFAM Double-sided Machine involves a principle known as the 4-way Motion. Utility of the 4-way Motion reduces machining time, surpassing the 2-way and 3-way Double sided machines.

  • precision fabrication of thin copper substrate by double

    Precision Fabrication of Thin Copper Substrate by Double

    After that, double-sided lapping is conducted to improve the flatness and remove the superfluous material. In the process, the machining efficiency increases significantly with both surfaces processed at the same time. In addition, double-sided lapping causes the interior stress relaxation similar on both surfaces, which can avoid the deformation.

  • double sided grinding and lapping machines

    double sided grinding and lapping machines

    Double Sided Grinding and Lapping Machines This double sided grinding machine can be used on a variety of materials to achieve a high degree of accuracy in flatness, parallelism and surface finish. Designed for use with Engis diamond plates, the Engis double sided grinding machine reduces your processing time, as well as overall cost.

  • uv release tape double sided easy to pick up for wafer back

    UV release tape double sided easy to pick up for wafer back

    UV release tape double sided is designed for processing of wafer grinding, cutting, fine electronic components, also suitable for all kinds of processing or cutting of small parts. Its high adhesive effect enables it to stick to the wafer, and it can even settle the small parts surely, thus ensure it works exactly during the grinding and cutting process.

  • double side face grinding machines

    double side face grinding machines

    Flat Honing is a type of double sided "fine grinding" where two opposed grinding wheels are used to remove stock from both faces of a flat part at the same time More Info Double Sided Grinding Machines - Engis Corporation

  • journal of microelectromechanicalsystems,vol.27,no.2

    JOURNAL OF MICROELECTROMECHANICALSYSTEMS,VOL.27,NO.2

    and accelerometers). Both sides of the wafer are processed, front side for patterning the device, back side for fabrication of seedless electroplated copper vias, where the highly doped Si device layer of the SOI wafer is used for direct depositionof copper. The double-sided process for thru-wafer interconnects

  • lapping / polishing / grinding | new and used semiconductor

    Lapping / Polishing / Grinding | New and Used Semiconductor

    Find new and used lapping polishing and grinding semiconductor equipment at LabX. ... maintenance or an installation for your lab equipment? ... 24 Hoffman Double ...

  • sapphire lapping and polishing process

    Sapphire Lapping and Polishing Process

    Sapphire Lapping and Polishing Process Single Crystal Sapphire. The use of Single Crystal Sapphire, as a high quality original opto-mechatronic material in the information age, is growing rapidly because of its excellent mechanical features such as stability and optic permeability.

  • precision lapping and polishing systems

    PRECISION LAPPING AND POLISHING SYSTEMS

    diamond pastes, slurries and composite lapping/polishing materials in our purpose built facilities strictly manufactured to ISO 9001:2015 quality standards. Kemet Precision Lapping and Polishing Systems offer the most efficient and reliable method of producing precise surface geometry and finish whether flat, contoured or spherical.