Bench-Top Double Side Lapping Grinding Polishing for Si,Ge and oxide single crystal wafer- EQ-Unipol-160Ds

Bench-Top Double Side Lapping Grinding Polishing for Si,Ge and oxide single crystal wafer- EQ-Unipol-160Ds

  • bench-top double side lapping / polishing machine for max. 2

    Bench-Top Double Side Lapping / Polishing Machine for Max. 2

    EQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can lap and polish 4 pieces of wafers up to 2" in both side at the same time, and achieves TTV less than one micron in 2" diameter area. It is an idea tool to prepare Si, Ge and oxide single crystal wafer with 2" diameter or less in the laboratory.

  • bench-top double side lapping grinding polishing machine for

    Bench-top Double Side Lapping Grinding Polishing Machine For

    Bench-top Double Side Lapping Grinding Polishing Machine For Si,Ge And Oxide Single Crystal Wafer- Eq-unipol-160d , Bench-top Double Side Lapping Grinding Polishing Machine For Si,Ge And Oxide Single Crystal Wafer- Eq-unipol-160d,Double Side Lapping Polishing Machine,Lapping Polishing Machine,Eq-unipol-160d from Polisher Supplier or Manufacturer-Zhengzhou TCH ...

  • bench-top cnc double side lapping / polishing grinding

    Bench-top Cnc Double Side Lapping / Polishing Grinding

    EQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can lap and polish 4 pieces of wafers up to 2" in both side at the same time, and achieves TTV . less than one micron in 2" diameter area. It is an idea tool to prepare Si, Ge and oxide single crystal . wafer with 2" diameter or less in the laboratory.

  • bench-top double side lapping / polishing machine for max. 2

    Bench-top Double Side Lapping / Polishing Machine For Max. 2

    EQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can . lap and polish 4 pieces of wafers up to 2" in both side at the same time, and achieves TTV less than one . micron in 2" diameter area. It is an idea tool to prepare Si, Ge and oxide single crystal wafer with 2" diameter . or less in the laboratory. Technical parameter of Bench-Top Double Side Lapping Machine

  • china bench-top cnc double side lapping grinding machine

    China Bench-Top CNC Double Side Lapping Grinding Machine

    EQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can lap and polish 4 pieces of wafers up to 2" in both side at the same time, and achieves TTV less than one micron in 2" diameter area. It is an idea tool to prepare Si, Ge and oxide single crystal wafer with 2" diameter or less in the laboratory.

  • china side polish machine, china side polish machine

    China Side Polish Machine, China Side Polish Machine

    K1300 Automatic single side polishing machine This machine is suitable for stainless steel tableware, such as forks ,knife,shovel edge grinding and polishing as well as the brass hinge,stainless steel himge,iron hinge,aluminum gold window lock grinding polishing and other metal plane grinding polishing.

  • us6861360b2 - double-sided polishing process for producing a

    US6861360B2 - Double-sided polishing process for producing a

    There is also a process for producing a multiplicity of silicon semiconductor wafers by simultaneous double-side polishing between in each case one lower polishing plate and one upper polishing plate, which rotate, are parallel to one another and to which polishing cloth has been adhesively bonded, while a polishing agent, which contains abrasives or colloids, is being supplied, with at least 2 μm of silicon being removed, wherein a predetermined proportion of the semiconductor wafers is at ...

  • simultaneous double side grinding of silicon wafers: a

    Simultaneous double side grinding of silicon wafers: a

    The grinding wheel is a diamond cup wheel. The grinding wheel and the wafer rotate about their own rotation axes simultaneously, and the wheel is fed towards the wafer along its axis [9,12,13]. After the wafer front side is ground, the grinder flips the wafer over and continues to grind the back side.

  • double side polishing machine, double side polishing machine

    Double Side Polishing Machine, Double Side Polishing Machine

    About 3% of these are grinding machines, 2% are glass processing machinery, and 1% are other metal & metallurgy machinery. A wide variety of double side polishing machine options are available to you, such as bench polisher, sharpeners.

  • bench-top double side lapping / polishing machine for max. 2

    Bench-Top Double Side Lapping / Polishing Machine for Max. 2

    Description: EQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can lap and polish 4 pieces of wafers up to 2" in both side at the same time, and achieves TTV less than one micron in 2" diameter area.

  • bench-top double side lapping / polishing machine for max. 2

    Bench-Top Double Side Lapping / Polishing Machine for Max. 2

    EQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can lap and polish 4 pieces of wafers up to 2 Sitemap | Add to favorites

  • double-sided lapping and polishing of wafers of brittle

    Double-sided lapping and polishing of wafers of brittle

    Lapping / Polishing (Wafers of brittle material) We are able to stably supply ultra-thin, high precision double sided lapping and polishing brittle wafers, focusing on crystal. In lapping process, the both sides of a wafer are polished simultaneously between upper and lower surface plates. It realizes high removal efficiency and processing accuracy.

  • single-side grinding and polishing

    Single-Side Grinding and Polishing

    Single-Side Grinding and Polishing. APO has the ability to achieve high precision flat optics through single-side grinding, polishing, and pitch polishing. Our state-of-the-art equipment is capable of producing up to 1/30 wave flat optical components. Single-side pitch polishing is available for optics such as mirrors, wedges, and prisms.

  • double side polished wafers - silicon valley microelectronics

    Double Side Polished Wafers - Silicon Valley Microelectronics

    Double Side Polished Wafers Silicon Valley Microelectronics’ product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. Double side polished wafers are typically required in semiconductor, MEMS, and other applications where wafers with tightly controlled flatness characteristics are required.

  • double side grinding and polishing

    Double side Grinding and Polishing

    Double-Side Polishing. APO provides double-side grinding and polishing of UV, Visible, and IR components including wafers, windows, and mirrors. We are proud to now offer laser grade super-polished wafers to less than 4 angstroms RMS surface roughness, at a standard grade price.

  • lapping / polishing / grinding | new and used semiconductor

    Lapping / Polishing / Grinding | New and Used Semiconductor

    Lapping / Polishing / Grinding Listings ... Speedfam 20B-5 Double Side Lappers and Polishers - Rebuilt ... ENGIS HYPREZ 28" SINGLE SIDE LAPPING SYSTEM. Price: $25,000.00.

  • wafer grinding & polishing services - thomasnet

    Wafer Grinding & Polishing Services - ThomasNet

    Capabilities include single-sided or double-sided polishing and blanchard, cylindrical, edge, surface, contour and optical grinding. Works with borosilicate, Borofloat® floating borosilicate, Pyrex®, Vycor®, fused silica or quartz, color filter and optical glass.

  • lapping and polishing si die and wafers - southbaytech

    Lapping and Polishing Si Die and Wafers - southbaytech

    For this experiment several different samples of a Si wafer were obtained for lapping and polishing experiments. The wafer pieces were cleaved into 10 mm x 20 mm rectangles as well as smaller 5 mm x 5 mm die sized squares. Each of these samples were then mounted onto a Model 155 Lapping Fixture using a low melting point wax (MWH 135) after being heated on the hot plate. The samples were affixed to the mounting block and then measured prior to lapping and polishing.

  • wafer polishing services - virgin and reclaim grade wafers | svm

    Wafer Polishing Services - Virgin and Reclaim grade wafers | SVM

    SVM Wafer Polishing Services available: Wafer diameters: 25mm (1 inch) – 300mm (12 inch) Single side polishing (SSP) Double side polishing (DSP) through simultaneous or “flip” polishing techniques. Backside polishing. Kiss polishing – Light polish which will remove minor surface scratches or defects. Wafers are in contact with a polishing wheel for just a few seconds to remove light surface damage. Chemical mechanical planarization (CMP) — This process flattens wafers and removes ...

  • double-sided lapping for parallelism and flatness

    Double-sided lapping for parallelism and flatness

    Double Sided Lapping and Polishing Metal Parts Planetary double sided lapping is the process of choice for achieving best flatness, thickness and parallelism on all types of metal parts. Valley provides both double side and single side lapping of metals including Stainless Steel, Aluminum, Copper, Titanium, alloys and others.

  • simultaneous double side grinding of silicon wafers: a

    Simultaneous double side grinding of silicon wafers: a

    The grinding wheel and the wafer rotate about their own rotation axes simultaneously, and the wheel is fed towards the wafer along its axis [9,12-13]. After the wafer front side is ground, the grinder flips the wafer over and continues to grind the back side. The advantages of SSG over lapping include [10,12-14]: 1)

  • double side grinding and polishing

    Double side Grinding and Polishing

    APO provides double-side grinding and polishing of UV, Visible, and IR components including wafers, windows, and mirrors. We are proud to now offer laser grade super-polished wafers to less than 4 angstroms RMS surface roughness, at a standard grade price.

  • wafer polishing | silicon wafer polishing | wafer polishing

    Wafer Polishing | Silicon Wafer Polishing | Wafer Polishing

    Silicon Wafer Polishing Processes. Wafer polishing is both highly effective and safe for removing stresses and surface damage. During the wafer polishing process, polishing pads and diamond liquid slurry are used to polish the wafer. The wafer is held in place by a vacuum carrier such that the backside of the wafer is exposed. The carrier and wafer are slowly brought into contact with a rotating platen, which is covered by a polishing pad.

  • sapphire lapping and polishing process

    Sapphire Lapping and Polishing Process

    Sapphire Lapping and Polishing Process Single Crystal Sapphire. The use of Single Crystal Sapphire, as a high quality original opto-mechatronic material in the information age, is growing rapidly because of its excellent mechanical features such as stability and optic permeability.

  • double side fine grinding/ lapping machine | double side

    Double side fine Grinding/ Lapping machine | double side

    Various grinding materials such as super hard abrasive: Diamond grinding plates, CBN(cubic boron nitride) grinding plates; Conventional abrasives: Cast iron plates, GC plates, etc can be adopted for different requirements of various products, so as to achieve double side precision grinding on work pieces made from various materials.

  • lapping / polishing / grinding | new and used semiconductor

    Lapping / Polishing / Grinding | New and Used Semiconductor

    Speedfam 20B-5 Double Side Lappers and Polishers - Rebuilt. Price: Please Inquire. Condition: Refurbished

  • kemet double side lapping / polishing machines

    Kemet Double Side Lapping / Polishing Machines

    Kemet Double Side Lapping Polishing MachinesKemet Dual Face Machines grind, lap & polish both flat faces of the components at the same time. Able to process a wide range of materials and achieve very tight tolerance and consistentlyCustom Built Lapping MachinesA variety of custom built Double Side Lapping and Polishing machines are available to meet […]

  • double-sided lapping for parallelism and flatness

    Double-sided lapping for parallelism and flatness

    Planetary double sided lapping is the process of choice for achieving best flatness, thickness and parallelism on all types of metal parts. Valley provides both double side and single side lapping of metals including Stainless Steel, Aluminum, Copper, Titanium, alloys and others.

  • lapping / polishing / grinding | new and used semiconductor

    Lapping / Polishing / Grinding | New and Used Semiconductor

    Find new and used lapping polishing and grinding semiconductor equipment at LabX. ... Single Request, Multiple Offers ... 72” Diameter PR Hoffman Double Side ...

  • double sided polishing machine for stainless steel tube

    double sided polishing machine for stainless steel tube

    JINZHU®double sided polishing machine for stainless steel tube is designed on the basis of plate polishing machine.